5G communication modules put forward extremely high requirements for potting processes: low stress, low bubbles, and long-term reliability. This article focuses on the core advantages and process points of two-component dynamic valves in 5G module potting.
Introduction
5G communication modules have high working frequency, large heat generation, and strict requirements for long-term reliability. The potting process must meet: low stress (avoid chip stress damage), low bubbles (avoid RF loss), and long-term reliability (meet 10-year lifespan). Dynamic mixing valves show unique advantages in these requirements.
1. Process Challenges of 5G Module Potting
- Chip stress sensitivity: curing shrinkage of potting adhesive may cause chip cracking
- RF performance sensitivity: bubbles will cause RF loss
- Long-term reliability: need to pass -40~125℃ temperature cycle and 1000-hour aging test
2. Process Advantages of Dynamic Mixing Valves
- Mixing uniformity: CV<1% (static tube mixing usually CV<3%)
- Short mixing time: millisecond level, avoiding adhesive pre-curing
- Bubble control: dynamic mixing + vacuum degassing dual approach
- Stress control: low shrinkage formula + low viscosity potting + flexible curing
3. Typical Process Solutions
- Equipment: two-component vacuum potting machine + dynamic mixing valve
- Adhesive: low-stress epoxy resin or polyurethane
- Process: vacuum degassing → dynamic mixing → potting in vacuum chamber → stepped curing
4. Key Process Parameters
- Mixing ratio accuracy: ±0.5%
- Vacuum degree: ≤-0.095MPa
- Potting temperature: 25~35℃
- Curing curve: stepped heating
5. Online Quality Control
- Online weighing to calibrate mixing ratio
- Online viscosity monitoring
- Visual inspection of potting appearance
- X-ray detection of bubbles (sampling)
6. Special Requirements for 5G Module Potting
- Low dielectric constant adhesive (avoid RF loss)
- Low CTE (coefficient of thermal expansion) adhesive (avoid thermal stress)
- High purity (avoid ion migration)
7. Key Points of Dynamic Valve Selection
- Adjustable speed range: 500~5000rpm
- Mixing elements: star type, tooth type
- Automatic cleaning function
- Vacuum-resistant design
Conclusion
5G module potting is the representative of high-end electronic packaging processes, and the introduction of dynamic mixing valves is an inevitable trend. Only through coordination from process, equipment, and adhesive can the stringent requirements of the 5G era be met.
Resource:
https://secondintelligent.com/product/second-ab-2k-two-part-component-glue-potting-filling-machine-accessories-parts-double-liquid-dynamic-glue-dispensing-valve/
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