Semiconductor packaging is one of the fields with the highest requirements for dispensing technology, and the automatic glue dispenser machine continues to innovate and make breakthroughs in this field. In chip-level packaging, the dispensing of underfill adhesive requires precise control of adhesive volume, ensuring complete filling of the gap between the chip and substrate without overflow contaminating solder joints. The automatic glue dispenser machine achieves micron-level dispensing precision and millisecond-level response speed through jet dispensing valves and visual positioning systems. In flip-chip packaging, the automatic glue dispenser machine needs to complete precise adhesive allocation within extremely small spaces, placing extremely high demands on the precision and stability of the motion control system.
Resource:
https://secondintelligent.com/industry-news/potting-processes-in-leading-energy-storage-battery-manufacturers/
With the development of 5G and AI chips, packaging density continues to increase, and the Second Intelligent Equipment automatic glue dispenser machine is also continuously upgrading, from single-valve dispensing to multi-valve parallel dispensing, from fixed path programming to AI adaptive path planning. Additionally, the automatic glue dispenser machine integrates 3D visual inspection functions, achieving inline quality inspection after dispensing, promptly detecting defects such as missed or excess adhesive. The technological advancement of the automatic glue dispenser machine has effectively driven the continuous development of semiconductor packaging processes.
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